The Wing Gundam kit in front of us is a 30-gram piece of plastic with measurable mechanical properties. From the multi-color runner to the polycap socket geometry, every choice is the product of a specific historical sequence at Bandai. The HG grade did not exist until 1990. The polycap system did not exist before that. The Wing Gundam itself was not designed until 1995 and was redesigned in 1997. Reading the kit without the history leaves you looking at the shape without the process that produced it.
GunPla's engineering history runs in parallel with Bandai's capacity to mold ever more parts at ever finer detail. Each grade introduction below brought an engineering capability that was new at the time of its release.